SmartDV’s AHB Multilayer Interconnect IP is a silicon-proven, high-throughput solution designed to manage complex on-chip communication in SoC designs. It enables efficient arbitration and data transfer between multiple AHB masters and slaves, ensuring low-latency and high-bandwidth performance across the system.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. Its scalable architecture supports multiple layers, enabling concurrent data transfers and maximizing system efficiency for a wide range of embedded applications.