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APB Multilayer Interconnect
Design IP
Overview

SmartDV’s APB (Advanced Peripheral Bus) Multilayer Interconnect IP enables efficient communication between multiple APB masters and slaves, streamlining peripheral access in complex SoC designs. Ideal for low-bandwidth control path communications, it supports parallel transactions and arbitration mechanisms to ensure low-latency and high-throughput data transfers.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance.

AMBA Multilayer Interconnect
Benefits
  • Map User Interface signals with the AHB signals using a Control Logic
  • Configurable Data and Address Bus
  • Choose between Round-robin or Priority-Based Arbitration per Slave Selection
  • Full Protocol Support for Burst Transfers and Responses
  • Enhanced Throughput and Reduced Arbitration Overhead between Masters by conducting arbitration at each Slave port
Compliance and Compatibility
  • AMBA 5 AHB Specification
  • AMBA 3 AHB specification
  • AMBA 2 AHB specification
  • All major EDA synthesis, simulation, and linting flows